Dipartimento d'Ingegneria

Electronics - Elettronica

Electronic activity at DIEI can be gathered in 4 main fields:
 
Sensors, Circuits & Systems - This activity, mostly in the area of health monitoring, focuses on the design and test of CMOS Active Pixel Sensors integrated in VLSI sub-micrometer and vertical scale (3D-IC) technologies, on the development of a multi-channel analog front end for brain-computer interfaces (BCI), on a Lab-on-Chip (LoC) for viral infection diagnosis as well ason a real time dosimeter for Interventional Radiology.

Devices and technology - Activities are devoted to physical modeling and numerical analysis of semiconductor devices, to the study of thermal properties of micro electro mechanical systems and to the Silicon on Diamond (SoD) technology for radiation sensor and biomedical applications.

High Frequency - Activities in this branch are about RFID systems, RF Integrated circuits (RFIC), Front End design for telecommunication, telemetry and radiometers, System in Package (SiP) and interconnections. Most recently, specific attention has been devoted to solutions for Internet of Things (IoT) applications.

Green Electronics - Organic devices and low cost recyclable materials (mostly paper) are adopted here to develop circuits using inkjet printing as well as adhesive copper tape. Design approaches suitable for Wide Area Electronics (WAE) applications are being carried on, among them: chipless RFID tags, Harmonic RFID systems and Systems in Package on Paper (SiPoP).
 

ENIAC - ARTEMOS

In Projects ,
Written by Friday, 07 December 2012 06:23
Agile RF Transceivers and front-Ends for future smart Multi-standard cOmmunications applicationS.
Strategic Objective:
ARTEMOS aims at developing architecture and technologies for implementing agile radio frequency (RF) transceiver capacities in future radio communication products. These new architecture and technologies will be able to manage multi-standard (multi-band, multi-data-rate, and multi-waveform) operation with high modularity, low-power consumption, high reliability, high integration, low costs, low PCB area, and low bill of material (BOM).

Unit involvement:
The main obiective of the University of Perugia unit is the development of an envelope-tracking 2.4GHz power amplifier for WLAN applications. The circuit is based on a 90nm CMOS technology and uses a discrete resizing of the final transistors to reconfigure its output compression point from 20 to 30 dBm with a good power-added efficiency.

HFE-Lab

Written by Friday, 07 December 2012 06:13
High Frequency Electronics (HFE) Lab, was founded in 2001 by inheriting ten years of experience in the area of modeling and design of microwave electronic circuits. This experience has been further exploited and finalized to several technological and scientifc challenges. Among them it is worth mentioning those running at present:

APMC-2012

In Downloads ,
Written by Friday, 07 December 2012 03:26

Today at the Asia Pacific Micowave Conference (APMC) 2012, Luca Roselli gave the presentation:

"Heterogeneous Integration of Flexible Substrate Spiral Antennas and Silicon Chips by Magnetic Coupling"
Authors: L. Aluigi, F. Alimenti, L. Roselli, T.T. Thai, M.M. Tentzeris

ABSTRACT:
A new contactless assembly method for SoC wireless transceivers and antennas on flexible and paper substrates is presented. An Archimedean spiral antenna, matched to an heterogeneous transformer which couples the received power to the chip has been simulated at 1.5 GHz. Finally, as a proof-of-concept a prototype is fabricated and experimented. The measurement of the whole structure (antenna and transformer) shows a |S11| of about -12 dB at 1.5 GHz, in a fair good agreement with simulations.

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