Dipartimento d'Ingegneria

Electronics - Elettronica

Electronic activity at DIEI can be gathered in 4 main fields:
 
Sensors, Circuits & Systems - This activity, mostly in the area of health monitoring, focuses on the design and test of CMOS Active Pixel Sensors integrated in VLSI sub-micrometer and vertical scale (3D-IC) technologies, on the development of a multi-channel analog front end for brain-computer interfaces (BCI), on a Lab-on-Chip (LoC) for viral infection diagnosis as well ason a real time dosimeter for Interventional Radiology.

Devices and technology - Activities are devoted to physical modeling and numerical analysis of semiconductor devices, to the study of thermal properties of micro electro mechanical systems and to the Silicon on Diamond (SoD) technology for radiation sensor and biomedical applications.

High Frequency - Activities in this branch are about RFID systems, RF Integrated circuits (RFIC), Front End design for telecommunication, telemetry and radiometers, System in Package (SiP) and interconnections. Most recently, specific attention has been devoted to solutions for Internet of Things (IoT) applications.

Green Electronics - Organic devices and low cost recyclable materials (mostly paper) are adopted here to develop circuits using inkjet printing as well as adhesive copper tape. Design approaches suitable for Wide Area Electronics (WAE) applications are being carried on, among them: chipless RFID tags, Harmonic RFID systems and Systems in Package on Paper (SiPoP).
 

In this project, we propose the application of numerical modelling, i.e. device-level simulation tools, to simulate the electrical characteristics of Silicon-on-Diamond (SoD) devices originally conceived for charged particle sensors but suitably applicable to bio-sensors.
Actually, the biocompatibility and electrochemical properties of diamond foster its adoption for bio-sensing applications. In particular, its high bio inertness, high electrochemical stability, and optical transparency make diamond a material of great interest for neuronal activity study.

Radio Wireless Week 2013

In Downloads ,
Written by Monday, 21 January 2013 23:38
January 22 2013 Luca Roselli gave a presentation to the Radio Wireless Week entitled:
"Chip-to-package wireless power transfer and its application to mm-wave antennas and monolithic radiometer receivers"
Luca Aluigi, Trang Thai, Manos Tentzeris, Federico Alimenti, Luca Roselli

and on January 23 Manos Tentzeris gave a presentation to the same conference entitled:
"An IPv6-enabled wireless shoe-mounted platform for health-monitoring"
Chiara Mariotti, Vasileios Lakafosis, Manos Tentzeris, Luca Roselli
adhesive-prototypes-220p
In last years, it has been demonstrated that the paper substrates can be used to fabricate planar circuits up to microwave frequencies. Despite of its relatively high dielectric losses (due to moisture and filler content), the paper substrate, the most common natural polymer, is ecocompatible, flexible and very cheap, thus it represents the best choice for green or large-area electronic applications. The typical example is a disposable wireless sensor that must be distributed in the environment without causing pollution problems, potentially reaching the 24GHz ISM frequency band.

In the above applications, the ink-jet or screen printing technology has been used to fabricate the wiring network or the sensor antenna. To this purpose, a conductive ink, based on Silver (Ag) nano-particles, is adopted along with a post-print curing process step. Here, the complementary vision of an electronic that can be sticked on-demand is proposed. A new fabrication process for the wiring network is demonstrated starting from a copper (Cu) adhesive tape. Such a tape is etched by means of a photo-lithographic technology, but a direct layout shaping with cutting machines is, in principle, possible. Then the circuit features are transferred to a paper substrate via a sacrificial layer. The main advantages of the Cu tape are a superior conductivity with respect to cured Ag ink and the possibility to solder standard electronic components on it.

To validate the proposed technology, several structures of practical interest have been fabricated and transferred from the Cu tape to the paper foil. The photograph, for example, shows a layout composed of several non-connected shapes, actually the soldering pads of a SMT transistor with a SOT353 package. The first microwave characterization has been carried-out studying the propagation characteristics of simple microstrip lines. Experimental results show an insertion loss better than 0.6 dB/cm at 10GHz for a Kodak photo-paper.

Federico Alimenti, Paolo Mezzanotte, Marco Dionigi, Marco Virili, Luca Roselli, "Microwave Circuits in Paper Substrates Exploiting Conductive Adhesive Tapes," IEEE Microwave and Wireless Components Letters, 2013, forthcoming.

TOP MELON

In Projects ,
Written by Saturday, 01 December 2012 15:08
The initiative wass realized by "3A-Parco Tecnologico Agroalimentare dell’Umbria" in cooperation with Top Melon s.r.l. and University of Perugia funded by Mis. 124 of PSR 2007-2013 of the Umbria Region.

The goals of the project were the realization of agricultural techniques in the chain of the melon in Umbria in order to extend the production period; the reduction of chemicals and the optimization of water resources.

Project activities:
  • test execution to evaluate the joint use of several means to protect/stimulate growing and different materials depending on the cultivation period;
  • characterization, in terms of physical and chemical parameters of the melons produced during the field tests;
  • realization of a innovative wireless sensor network to manage and optimize the water use

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